productname

component

viscosity cps

operating time    min

shear strength psi

hardness

volume resistivity    Ohm-cm

application and features

EO-20E

2

2000-4000

2 days

1600

D-75

＜0.0004

Conductive adhesive H20E corresponding product, suitable for conductive and thermal bonding of optical module

EO-21

2

40000

60

3000

D-84

＜0.0004

Chip Mount, Microwave Equipment, Replacement Soldering, LED Solid Crystal, Imaging Equipment, LCD Bonding, Semiconductor

EO-21M-5

2

1500

180

1700

D-75

＜0.0006

Microwave equipment, alternative welding, LED solid crystal, imaging equipment, LCD internal connection, substrate connection, low stress occasion

EO-24

2

3000

2天

1400

D-75

＜0.0004

Patch, LED solid crystal, quartz bonding, flip chip, low stress applications, meet NASA gas emission requirements

EO-30M-1

2

Paste

180

2000

D-72

＜0.001

MCM/hybrid patch, LED solid crystal, low stress occasion, EMI/RFI shielding, imaging equipment

EO-38M-3

2

35000

>1 day/span>

1700

D-88

＜0.0004

High temperature resistant, imaging equipment, LED solid crystal, microwave equipment, LCD internal connection, substrate connection, patch

EO-83M-2

1

14000

>4 weeks

1600

D-88

＜0.0002

Chip Mount, Microwave Equipment, Substrate Connection, Medical Equipment, Semiconductor Patch, MEMS Device

EO-97M

1

12000

>4 weeks

1300

D-89

＜0.0004

Chip mounting, microwave equipment, substrate connection, alternative soldering

EO-98HT

1

55000

>4 weeks

1200

D-85

＜0.0004

High temperature resistance, imaging equipment, substrate connection, microwave equipment, LCD interconnection, chip mounting