As the most popular placement technology in the electronics industry, SMT chip processing and assembly has a very wide range of applications in the market.

 

The most common SMT patch assembly methods can be divided into single-sided assembly, single-sided mixing, double-sided assembly, and double-sided mixing. Among them, the types of circuit substrates used for single-sided assembly and double-sided assembly are single-sided PCB and double-sided PCB, respectively, and the mixing method is more complicated. Single-sided mixing can be divided into first-paste method and post-paste method, while double-sided assembly is divided into SMC/SMD and FHC ipsilateral mode and SMC/SMD and iFHC different side modes, so we will not introduce them one by one. .

 

 

Next, let's take a look at the process flow of SMT patch assembly. Different assembly methods correspond to different assembly processes, and a reasonable assembly process is also a guarantee of assembly quality and assembly efficiency. After the assembly method is determined, the process flow can be determined for the actual product and the specific equipment. Due to limited time, only the process of single and double-sided mixing is introduced here:

 

 

1. Single-sided mixing: incoming material inspection + PCB A-side silk screen solder paste (red glue) + patch + A surface reflow (cure) + cleaning + plug-in + wave peak + cleaning + detection + rework.

 

 

2, double-sided mixing: incoming material detection + PCB B-side silk screen solder paste (red plastic) + patch + B surface reflow (curing) + cleaning + flip + A surface silk screen solder paste (red plastic) + patch +B surface reflow (curing) or (DIP + crest) + cleaning + detection + rework.

 

 

Seeing here, everyone should know more about the SMT patch assembly method and process flow, or not? For customers who need it, only by selecting the SMT patch assembly and processing factory, can we guarantee the quality and delivery of electronic products, and really save the effort.